Crown, QinetiQ tackle RFID metal-packaging challenges

Posted on 05 October 2006

Crown and QinetiQ have partnered to solve the signal reflection, detuning and grounding problems that plague RFID use in metal packaging.

The companies have launched a joint development program to adapt QinetiQ’s Omni-ID Pak RFID. QinetiQ’s standalone Omni-ID Tag and integrated Omni-ID Pak technology reportedly allows a UHF tag to be mounted directly onto the metal substrate.

Measuring less than 1 millimeter in thickness, the unique Omni-ID structure reportedly collects and focuses RF energy and enables coupling to the chip. The companies say that the RFID chips require only a short coupling antenna rather than the larger dipole.