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Crown and QinetiQ have partnered to solve the signal reflection, detuning and grounding problems that plague RFID use in metal packaging.
The companies have launched a joint development program to adapt QinetiQs Omni-ID Pak RFID. QinetiQs standalone Omni-ID Tag and integrated Omni-ID Pak technology reportedly allows a UHF tag to be mounted directly onto the metal substrate.
Measuring less than 1 millimeter in thickness, the unique Omni-ID structure reportedly collects and focuses RF energy and enables coupling to the chip. The companies say that the RFID chips require only a short coupling antenna rather than the larger dipole.
The companies have launched a joint development program to adapt QinetiQs Omni-ID Pak RFID. QinetiQs standalone Omni-ID Tag and integrated Omni-ID Pak technology reportedly allows a UHF tag to be mounted directly onto the metal substrate.
Measuring less than 1 millimeter in thickness, the unique Omni-ID structure reportedly collects and focuses RF energy and enables coupling to the chip. The companies say that the RFID chips require only a short coupling antenna rather than the larger dipole.
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